Transmit power management for a communication device and method for use therewith

ABSTRACT

In integrated circuit includes a processing module that determines a selected one of the plurality of power modes based on a function being currently performed by at least one non-transceiver module of a host device, and generates a power mode signal based on the selected one of the plurality of power modes. An RF transmitter generates a transmit signal at a selected one of the plurality of operating power levels based on the power mode signal and that operates from at least one transmitter power supply signal generated and selected by a power management circuit in response to the power mode signal.

CROSS REFERENCE TO RELATED APPLICATIONS

The present U.S. Utility Patent Application claims priority pursuant to35 U.S.C. §120, as a continuation, to the following U.S. Utility PatentApplication which is hereby incorporated herein by reference in itsentirety and made part of the present U.S. Utility Patent Applicationfor all purposes:

-   -   1. U.S. Utility patent application Ser. No. 13/539,219, entitled        “TRANSMIT POWER MANAGEMENT FOR A COMMUNICATION DEVICE AND METHOD        FOR USE THEREWITH,” (Attorney Docket No. BP5992C3), filed Jun.        29, 2012, which claims priority pursuant to 35 U.S.C. §120, as a        continuation, to the following U.S. Utility Patent Application        which is hereby incorporated herein by reference in its entirety        and made part of the present U.S. Utility Patent Application for        all purposes:    -   2. U.S. Utility patent application Ser. No. 13/186,912, entitled        “TRANSMIT POWER MANAGEMENT FOR A COMMUNICATION DEVICE AND METHOD        FOR USE THEREWITH,” (Attorney Docket No. BP5992C2), filed Jul.        20, 2011, issued as U.S. Pat. No. 8,233,847 on Jul. 31, 2012,        which claims priority pursuant to 35 U.S.C. §120, as a        continuation, to the following U.S. Utility Patent Application        which is hereby incorporated herein by reference in its entirety        and made part of the present U.S. Utility Patent Application for        all purposes:    -   3. U.S. Utility patent application Ser. No. 12/624,277, entitled        “TRANSMIT POWER MANAGEMENT FOR A COMMUNICATION DEVICE AND METHOD        FOR USE THEREWITH,” (Attorney Docket No. BP5992C1) filed Nov.        23, 2009, issued as U.S. Pat. No. 8,010,059 on Aug. 30, 2011,        which claims priority pursuant to 35 U.S.C. §120, as a        continuation, to the following U.S. Utility Patent Application        which is hereby incorporated herein by reference in its entirety        and made part of the present U.S. Utility Patent Application for        all purposes:    -   4. U.S. Utility patent application Ser. No. 11/700,631, entitled        “TRANSMIT POWER MANAGEMENT FOR A COMMUNICATION DEVICE AND METHOD        FOR USE THEREWITH,” (Attorney Docket No. BP5992) filed on Jan.        30, 2007, issued as U.S. Pat. No. 7,643,800 on Jan. 5, 2010.

BACKGROUND OF THE INVENTION

1. Technical Field of the Invention

This invention relates generally to mobile communication devices andmore particularly to a circuit for managing power in an RF integratedcircuit.

2. Description of Relate Art

As is known, integrated circuits are used in a wide variety of productsincluding, but certainly not limited to, portable electronic devices,computers, computer networking equipment, home entertainment, automotivecontrols and features, and home appliances. As is also known, integratedcircuits include a plurality of circuits in a very small space toperform one or more fixed or programmable functions.

Power management can be an important consideration for electronicdevices, particularly for mobile devices that operate from batterypower. Lowering the power consumption of a device can increase batterylife, or conversely, can potentially decrease the size of the batterythat is required, with a corresponding decrease in weight and size.

The advantages of the present invention will be apparent to one skilledin the art when presented with the disclosure herein.

BRIEF SUMMARY OF THE INVENTION

The present invention is directed to apparatus and methods of operationthat are further described in the following Brief Description of theDrawings, the Detailed Description of the Invention, and the claims.Other features and advantages of the present invention will becomeapparent from the following detailed description of the invention madewith reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING(S)

FIG. 1 is a schematic block diagram of an embodiment of a communicationsystem in accordance with the present invention;

FIG. 2 is a schematic block diagram of an embodiment of anothercommunication system in accordance with the present invention;

FIG. 3 is a schematic block diagram of an embodiment of an integratedcircuit in accordance with the present invention;

FIG. 4 is a schematic block diagram of another embodiment of anintegrated circuit in accordance with the present invention;

FIG. 5 is a schematic block diagram of an embodiment of an RFtransceiver in accordance with the present invention;

FIG. 6 is a schematic block diagram of an embodiment of power managementcircuitry in accordance with the present invention;

FIG. 7 is a schematic block diagram of another embodiment of powermanagement circuitry in accordance with the present invention;

FIG. 8 is a schematic block diagram of an embodiment of a radiotransmitter front-end in accordance with the present invention;

FIG. 9 is a schematic block diagram of an embodiment of a poweramplifier in accordance with the present invention;

FIG. 10 is a schematic block diagram of an embodiment of another poweramplifier in accordance with the present invention;

FIG. 11 is a side view of a pictorial representation of an integratedcircuit package in accordance with the present invention.

FIG. 12 is a bottom view of a pictorial representation of an integratedcircuit package in accordance with the present invention.

FIG. 13 is a flow chart of an embodiment of a method in accordance withthe present invention; and

FIG. 14 is a flow chart of an embodiment of a method in accordance withthe present invention.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 1 is a schematic block diagram of an embodiment of a communicationsystem in accordance with the present invention. In particular acommunication system is shown that includes a communication device 10that communicates real-time data 24 and non-real-time data 26 wirelesslywith one or more other devices such as base station 18, non-real-timedevice 20, real-time device 22, and non-real-time and/or real-timedevice 24. In addition, communication device 10 can also optionallycommunicate over a wireline connection with non-real-time device 12,real-time device 14 and non-real-time and/or real-time device 16.

In an embodiment of the present invention the wireline connection 28 canbe a wired connection that operates in accordance with one or morestandard protocols, such as a universal serial bus (USB), Institute ofElectrical and Electronics Engineers (IEEE) 488, IEEE 1394 (Firewire),Ethernet, small computer system interface (SCSI), serial or paralleladvanced technology attachment (SATA or PATA), or other wiredcommunication protocol, either standard or proprietary. The wirelessconnection can communicate in accordance with a wireless networkprotocol such as IEEE 802.11, Bluetooth, Ultra-Wideband (UWB), WIMAX, orother wireless network protocol, a wireless telephony data/voiceprotocol such as Global System for Mobile Communications (GSM), GeneralPacket Radio Service (GPRS), Enhanced Data Rates for Global Evolution(EDGE), Personal Communication Services (PCS), or other mobile wirelessprotocol or other wireless communication protocol, either standard orproprietary. Further, the wireless communication path can includeseparate transmit and receive paths that use separate carrierfrequencies and/or separate frequency channels. Alternatively, a singlefrequency or frequency channel can be used to bi-directionallycommunicate data to and from the communication device 10.

Communication device 10 can be a mobile phone such as a cellulartelephone, a personal digital assistant, game console, personalcomputer, laptop computer, or other device that performs one or morefunctions that include communication of voice and/or data via wirelineconnection 28 and/or the wireless communication path. In an embodimentof the present invention, the real-time and non-real-time devices 12, 1416, 18, 20, 22 and 24 can be personal computers, laptops, PDAs, mobilephones, such as cellular telephones, devices equipped with wirelesslocal area network or Bluetooth transceivers, FM tuners, TV tuners,digital cameras, digital camcorders, or other devices that eitherproduce, process or use audio, video signals or other data orcommunications.

In operation, the communication device includes one or more applicationsthat include voice communications such as standard telephonyapplications, voice-over-Internet Protocol (VoIP) applications, localgaming, Internet gaming, email, instant messaging, multimedia messaging,web browsing, audio/video recording, audio/video playback, audio/videodownloading, playing of streaming audio/video, office applications suchas databases, spreadsheets, word processing, presentation creation andprocessing and other voice and data applications. In conjunction withthese applications, the real-time data 26 includes voice, audio, videoand multimedia applications including Internet gaming, etc. Thenon-real-time data 24 includes text messaging, email, web browsing, fileuploading and downloading, etc.

In an embodiment of the present invention, the communication device 10includes an integrated circuit, such as a combined voice, data and RFintegrated circuit that includes one or more features or functions ofthe present invention. Such integrated circuits shall be described ingreater detail in association with FIGS. 3-14 that follow.

FIG. 2 is a schematic block diagram of an embodiment of anothercommunication system in accordance with the present invention. Inparticular, FIG. 2 presents a communication system that includes manycommon elements of FIG. 1 that are referred to by common referencenumerals. Communication device 30 is similar to communication device 10and is capable of any of the applications, functions and featuresattributed to communication device 10, as discussed in conjunction withFIG. 1. However, communication device 30 includes two separate wirelesstransceivers for communicating, contemporaneously, via two or morewireless communication protocols with data device 32 and/or data basestation 34 via RF data 40 and voice base station 36 and/or voice device38 via RF voice signals 42.

FIG. 3 is a schematic block diagram of an embodiment of an integratedcircuit in accordance with the present invention. In particular, a voicedata RF integrated circuit (IC) 50 is shown that implementscommunication device 10 in conjunction with microphone 60,keypad/keyboard 58, memory 54, speaker 62, display 56, camera 76,antenna interface 52 and wireline port 64. In addition, voice data RF IC50 includes a transceiver 73 with RF and baseband modules for formattingand modulating data into RF real-time data 26 and non-real-time data 24and transmitting this data via an antenna interface 72 and an antenna.Further, voice data RF IC 50 includes an input/output module 71 withappropriate encoders and decoders for communicating via the wirelineconnection 28 via wireline port 64, an optional memory interface forcommunicating with off-chip memory 54, a codec for encoding voicesignals from microphone 60 into digital voice signals, a keypad/keyboardinterface for generating data from keypad/keyboard 58 in response to theactions of a user, a display driver for driving display 56, such as byrendering a color video signal, text, graphics, or other display data,and an audio driver such as an audio amplifier for driving speaker 62and one or more other interfaces, such as for interfacing with thecamera 76 or the other peripheral devices.

Off-chip power management circuit 95 includes one or more DC-DCconverters, voltage regulators, current regulators or other powersupplies for supplying the voice data RF IC 50 and optionally the othercomponents of communication device 10 and/or its peripheral devices withsupply voltages and or currents (collectively power supply signals) thatmay be required to power these devices. Off-chip power managementcircuit 95 can operate from one or more batteries, line power and/orfrom other power sources, not shown. In particular, off-chip powermanagement module can selectively supply power supply signals ofdifferent voltages, currents or current limits or with adjustablevoltages, currents or current limits in response to power mode signalsreceived from the voice data RF IC 50. Voice Data RF IC 50 optionallyincludes an on-chip power management circuit 95′ for replacing theoff-chip power management circuit 95.

In an embodiment of the present invention, the voice data RF IC 50 is asystem on a chip integrated circuit that includes at least oneprocessing device. Such a processing device, for instance, processingmodule 225, may be a microprocessor, micro-controller, digital signalprocessor, microcomputer, central processing unit, field programmablegate array, programmable logic device, state machine, logic circuitry,analog circuitry, digital circuitry, and/or any device that manipulatessignals (analog and/or digital) based on operational instructions. Theassociated memory may be a single memory device or a plurality of memorydevices that are either on-chip or off-chip such as memory 54. Such amemory device may be a read-only memory, random access memory, volatilememory, non-volatile memory, static memory, dynamic memory, flashmemory, and/or any device that stores digital information. Note thatwhen the Voice Data RF IC 50 implements one or more of its functions viaa state machine, analog circuitry, digital circuitry, and/or logiccircuitry, the associated memory storing the corresponding operationalinstructions for this circuitry is embedded with the circuitrycomprising the state machine, analog circuitry, digital circuitry,and/or logic circuitry.

In operation, the voice data RF IC 50 executes operational instructionsthat implement one or more of the applications (real-time ornon-real-time) attributed to communication devices 10 and 30 asdiscussed in conjunction with FIGS. 1 and 2. Further, RF IC 50 includespower management features in accordance with the present invention thatwill be discussed in greater detail in association with FIG. 5.

FIG. 4 is a schematic block diagram of another embodiment of anintegrated circuit in accordance with the present invention. Inparticular, FIG. 4 presents a communication device 30 that includes manycommon elements of FIG. 3 that are referred to by common referencenumerals. Voice data RF IC 70 is similar to voice data RF IC 50 and iscapable of any of the applications, functions and features attributed tovoice data RF IC 50 as discussed in conjunction with FIG. 3. However,voice data RF IC 70 includes two separate wireless transceivers 73 and75 for communicating, contemporaneously, via two or more wirelesscommunication protocols via RF data 40 and RF voice signals 42.

In operation, the voice data RF IC 70 executes operational instructionsthat implement one or more of the applications (real-time ornon-real-time) attributed to communication device 10 as discussed inconjunction with FIG. 1. Further, RF IC 70 includes power managementfeatures in accordance with the present invention that will be discussedin greater detail in association with FIG. 5.

FIG. 5 is a schematic block diagram of an RF transceiver 125, such astransceiver 73 or 75, which may be incorporated in communication devices10 and/or 30. The RF transceiver 125 includes an RF transmitter 129, anRF receiver 127 coupled to the processing module 225. The RF receiver127 includes a RF front end 140, a down conversion module 142, and areceiver processing module 144. The RF transmitter 129 includes atransmitter processing module 146, an up conversion module 148, and aradio transmitter front-end 150.

As shown, the receiver and transmitter are each coupled to an antennathrough an off-chip antenna interface 171 and a diplexer (duplexer) 177,that couples the transmit signal 155 to the antenna to produce outboundRF signal 170 and couples inbound RF signal 152 to produce receivedsignal 153. While a single antenna is represented, the receiver andtransmitter may each employ separate antennas or share a multipleantenna structure that includes two or more antennas. In anotherembodiment, the receiver and transmitter may share a multiple inputmultiple output (MIMO) antenna structure that includes a plurality ofantennas. Each antenna may be fixed, programmable, an antenna array orother antenna configuration. Accordingly, the antenna structure of thewireless transceiver will depend on the particular standard(s) to whichthe wireless transceiver is compliant and the applications thereof.

In operation, the transmitter receives outbound data 162 from a hostdevice or other source via the transmitter processing module 146. Thetransmitter processing module 146 processes the outbound data 162 inaccordance with a particular wireless communication standard (e.g., IEEE802.11, Bluetooth, RFID, GSM, CDMA, et cetera) to produce baseband orlow intermediate frequency (IF) transmit (TX) signals 164. The basebandor low IF TX signals 164 may be digital baseband signals (e.g., have azero IF) or digital low IF signals, where the low IF typically will bein a frequency range of one hundred kilohertz to a few megahertz. Notethat the processing performed by the transmitter processing module 146includes, but is not limited to, scrambling, encoding, puncturing,mapping, modulation, and/or digital baseband to IF conversion. Furthernote that the transmitter processing module 146 may be implemented usinga shared processing device, individual processing devices, or aplurality of processing devices and may further include memory. Such aprocessing device may be a microprocessor, micro-controller, digitalsignal processor, microcomputer, central processing unit, fieldprogrammable gate array, programmable logic device, state machine, logiccircuitry, analog circuitry, digital circuitry, and/or any device thatmanipulates signals (analog and/or digital) based on operationalinstructions. The memory may be a single memory device or a plurality ofmemory devices. Such a memory device may be a read-only memory, randomaccess memory, volatile memory, non-volatile memory, static memory,dynamic memory, flash memory, and/or any device that stores digitalinformation. Note that when the processing module 146 implements one ormore of its functions via a state machine, analog circuitry, digitalcircuitry, and/or logic circuitry, the memory storing the correspondingoperational instructions is embedded with the circuitry comprising thestate machine, analog circuitry, digital circuitry, and/or logiccircuitry.

The up conversion module 148 includes a digital-to-analog conversion(DAC) module, a filtering and/or gain module, and a mixing section. TheDAC module converts the baseband or low IF TX signals 164 from thedigital domain to the analog domain. The filtering and/or gain modulefilters and/or adjusts the gain of the analog signals prior to providingit to the mixing section. The mixing section converts the analogbaseband or low IF signals into up converted signals 166 based on atransmitter local oscillation 168.

The radio transmitter front end 150 includes a power amplifier and mayalso include a transmit filter module. The power amplifier amplifies theup converted signals 166 to produce outbound RF signals 170, which maybe filtered by the transmitter filter module, if included. The antennastructure transmits the outbound RF signals 170 to a targeted devicesuch as a RF tag, base station, an access point and/or another wirelesscommunication device via an antenna interface 171 coupled to an antennathat provides impedance matching and optional bandpass filtration.

The receiver receives inbound RF signals 152 via the antenna andoff-chip antenna interface 171 that operates to process the inbound RFsignal 152 into received signal 153 for the receiver front-end 140. Ingeneral, antenna interface 171 provides impedance matching of antenna tothe RF front-end 140 and optional bandpass filtration of the inbound RFsignal 152. This interface can be either fixed or programmable based onthe control signals 169 to adapt the impedance matching of the antennainterface to the particular mismatch conditions of the RF transmitter129, as will be discussed in greater detail in conjunction with FIGS.8-9.

The down conversion module 70 includes a mixing section, an analog todigital conversion (ADC) module, and may also include a filtering and/orgain module. The mixing section converts the desired RF signal 154 intoa down converted signal 156 that is based on a receiver localoscillation 158, such as an analog baseband or low IF signal. The ADCmodule converts the analog baseband or low IF signal into a digitalbaseband or low IF signal. The filtering and/or gain module high passand/or low pass filters the digital baseband or low IF signal to producea baseband or low IF signal 156. Note that the ordering of the ADCmodule and filtering and/or gain module may be switched, such that thefiltering and/or gain module is an analog module.

The receiver processing module 144 processes the baseband or low IFsignal 156 in accordance with a particular wireless communicationstandard (e.g., IEEE 802.11, Bluetooth, RFID, GSM, CDMA, et cetera) toproduce inbound data 160. The processing performed by the receiverprocessing module 144 includes, but is not limited to, digitalintermediate frequency to baseband conversion, demodulation, demapping,depuncturing, decoding, and/or descrambling. Note that the receiverprocessing modules 144 may be implemented using a shared processingdevice, individual processing devices, or a plurality of processingdevices and may further include memory. Such a processing device may bea microprocessor, micro-controller, digital signal processor,microcomputer, central processing unit, field programmable gate array,programmable logic device, state machine, logic circuitry, analogcircuitry, digital circuitry, and/or any device that manipulates signals(analog and/or digital) based on operational instructions. The memorymay be a single memory device or a plurality of memory devices. Such amemory device may be a read-only memory, random access memory, volatilememory, non-volatile memory, static memory, dynamic memory, flashmemory, and/or any device that stores digital information. Note thatwhen the receiver processing module 144 implements one or more of itsfunctions via a state machine, analog circuitry, digital circuitry,and/or logic circuitry, the memory storing the corresponding operationalinstructions is embedded with the circuitry comprising the statemachine, analog circuitry, digital circuitry, and/or logic circuitry.

In operation, processing module 225 determines a selected one of theplurality of power modes, such as based on current use characteristicsof the at least one application, the particular application beingexecuted or based on other factors defined by the operationalinstructions being executed. In addition, processing module 225generates a power mode signal 169 based on the selected one of theplurality of power modes. RF transmitter 129 has a plurality ofoperating power ranges and operates in a selected one of the pluralityof operating ranges based on the power mode signal 169.

FIG. 6 is a schematic block diagram of an embodiment of power managementcircuitry in accordance with the present invention. In particular,selected modules of voice data RF IC 50 or 70 are shown that includeprocessing module 225, memory module 230, and clock signal generator202. In an embodiment of the present invention, memory module 230 storesa least one application, such as application 232 and/or application 234that may include any of the applications discussed in conjunction withFIGS. 1-4, as well as other interface applications, system utilities, orother programs executed by processing module 225 to perform thefunctions and features of communication device 10 or 30. Theseapplications are stored in memory module 230 and/or an off-chip memorysuch as memory 54, as a plurality of operational instructions. Dependingon which application is being executed by the processing module 225, theuse characteristics of that application at a given time or theparticular application being executed may be used to determine a powermode that corresponds to a power level or range or power levels for theRF transmitter 129.

Off-chip power management circuit 95 receives the power mode signal 169as part of power mode signals 208 and generates a plurality of powersupply signals 204 to power off-chip modules and on-chip modules thatare currently in use and at least one selected transmitter power supplysignal that is based on the power mode signal 169 and the current powermode or RF transmitter 129. For example, the various power modes of RFtransmitter 129 can include a low, medium and high power ranges of powerlevels. Power mode signal 169, included in power mode signals 208, caninform the off-chip power management circuit of the selected power modeof the RF transmitter 129 so that off-chip power management circuit 95can supply the necessary power supply signals 204 to meet the powerdemands of the selected mode of operation. This methodology allows powerto be generated for the RF transmitter, only as required to address thecurrent power mode in use.

Also, if communication device 10 or 30 is using certain peripheraldevices and/or certain interfaces or modules at a given time, off-chippower management circuit 95 can be commanded to supply only those powersupply signals 204 that are required based on the peripheral devices,interfaces and/or other modules that are in use. Further, if a USBdevice is coupled to wireline port 64, then a power mode command can besent to off-chip power management module 95 to generate a power supplysignal 204 that supplies a power supply voltage, (such as a 5 volt, 8milliamp supply voltage) to the wireline port 64 in order to power theUSB device or devices connected thereto. In another example, if thecommunication device 10 includes a mobile communication device thatoperates in accordance with a GSM or EDGE wireless protocol, theoff-chip power management circuit 95 can generate supply voltages forthe baseband and RF modules of the transceiver only when the transceiveris operating.

Further, peripheral devices, such as the camera 76, memory 54,keypad/keyboard 58, microphone 60, display 56, and speaker 62 can bepowered when these peripheral devices are attached (to the extent thatthey can be detached) and to the extent that these devices are currentlyin use by the application.

The power management features of the present invention operate based onthe processing module determining, for the current application beingexecuted with corresponding current use characteristics, the currentpower mode of a plurality of power modes. In particular, processingmodule 225 when executing the application, selects a current power modebased on current use characteristics of the application, and generates apower mode signal 208 based on the selected power modes. In anembodiment of the present invention, processing module 225 maintains aregister that indicates for a plurality of modules, interfaces and/orperipheral devices either, whether that device is currently being usedor a power flag, such as power off, power on, high power, low power,medium power, etc, for that particular device, module and/or interface(when these devices are themselves capable in operating in differentpower modes). In addition, processing module, via look-up table,calculation or other processing routine, determines power mode 208 bydetermining the particular power supply signals required to be generatedbased on the devices in use and optionally their own power states.

The off-chip power management circuit 95 can be implemented as amulti-output programmable power supply, that receives the power modesignal 208 and generates and optionally routes the power supply signals204 to particular ports, pins or pads of voice data RF IC 50 or 70 ordirectly to peripheral devices via a switch matrix, as commanded basedon the power mode signal. In an embodiment of the present invention, thepower mode signal 208 is decoded by the off-chip power management moduleto determine the particular power supply signals to be generated, andoptionally—their characteristics such as voltage, current and/or currentlimit. As shown, voice data RF IC 50 or 70 optionally generates a clocksignal 206 via clock signal generator 202, or otherwise couples a clocksignal 206 generated off-chip to the off-chip power management circuit95. The off-chip power management circuit 95 operates based on the clocksignal 206.

In an embodiment of the present invention, voice data RF IC 50 or 70couples the power mode signal 208 to the off-chip power managementcircuit 95 via one or more dedicated digital lines that comprise aparallel interface. Further, the voice data RF IC 50 or 70 can couplethe power mode signal 208 to the off-chip power management circuit via aserial communication interface such as an I²C interface,serial/deserializer (SERDES) interface or other serial interface.

FIG. 7 is a schematic block diagram of another embodiment of powermanagement circuitry in accordance with the present invention. Thisembodiment includes similar elements described in conjunction with FIG.6 that are referred to by common reference numerals. In particular,on-chip power management circuit 95′ includes one or more DC-DCconverters, voltage regulators, current regulators or other powersupplies for supplying the voice data RF IC 50 or 70, and optionally theother components of communication device 10 and/or its peripheraldevices with supply voltages and or currents (collectively power supplysignals) that may be required to power these devices. On-chip powermanagement circuit 95′ can operate from one or more batteries, linepower and/or from other power sources, not shown. In particular, on-chippower management module 95′ can selectively supply power supply signalsof different voltages, currents or current limits or with adjustablevoltages, currents or current limits in response to power mode signals208 received from processing module 225. In this fashion, on-chip powermanagement circuit 95′ operates as off-chip power management module 95,but on an on-chip basis.

FIG. 8 is a schematic block diagram of an embodiment of a radiotransmitter front-end in accordance with the present invention. Inparticular, radio transmitter front-end 150 is shown that includes apower amplifier 180 that produces transmit signal 155 from up-convertedsignal 166. Power amplifier 180 operates at one or a plurality of powerlevels as set by power mode signal 169. Power supply signals 192, suchas one or more power supply signals 204, supply the necessary power topower amplifier 180 based on the selected power mode.

For example, power amplifier 180 can operate in a plurality of powermodes such as in a low, medium and high power mode. The supply voltageor current limit of power supply signals 192 can be modified by thepower management circuit 95 or 95′ and/or additional power supplysignals 192 can be supplied, based on the selected mode of operation. Ahigh current limit and/or high voltage can correspond to a high powermode. A medium current limit and/or medium supply voltage can correspondto the medium power mode. Further, a low current limit and/or low supplyvoltage can correspond to the low power mode.

FIG. 9 is a schematic block diagram of an embodiment of a poweramplifier in accordance with the present invention. In this embodimentpower amplifier 180 is implemented with a plurality of separate poweramplifier stages 182, 184, 186, etc. These series configured poweramplifier stages are powered separately by power supply signals 192 thatmay have different supply voltage and/or current limits. A switchingnetwork 190 couples the transmit signal 155 from the power amplifiers182, 184, 186, etc. in response to the power mode signal 169.

In a low power mode, power supply signals 192 supply power to only poweramplifier 182 designed for low power operation) and not to poweramplifiers 184 and 186, etc. The switching network 190 couples theoutput 183 of power amplifier 182 as the transmit signal 155. Thisreduces power consumption of the circuit in this low power mode. In amedium power mode, the output 183 of power amplifier 182 is amplifiedagain by power amplifier 184 to produce output 185 that is coupled byswitching network 190 as transmit signal 155. In this medium power mode,only power amplifiers 182 and 184 are fed power supply signals 192 fromthe power management circuit 95 or 95′ with the other power amplifiersleft unpowered. As can be seen, additional power modes can power more orall of the power amplifier stages to supply greater output power. Onlythose output stages in use are powered by power supply signals 192 inorder to conserve power.

FIG. 10 is schematic block diagram of an embodiment of another poweramplifier in accordance with the present invention. In this embodiment,a parallel configuration of power amplifiers 182, 184 and 186 arepresented, each corresponding to a separate power level. For instance,power amplifier 182 can operate at a low power range of −50 to −15 db,power amplifier 184 can operate at a medium power range of −15 to +10 dband power amplifier 186 can operate at a high power range of +10 to +28db. With each range corresponding to a separate power mode, theparticular power mode can be selected based on the desired power range.In operation, the corresponding power amplifier is supplied power by thecorresponding one of the power supply signals 192 (having acorresponding supply voltage and/or current limit) with its outputcoupled as transmit signal 155 by switching network 194. The other poweramplifiers can be left unpowered in order to conserve power.

FIG. 11 is a side view of a pictorial representation of an embodiment ofan integrated circuit package in accordance with the present invention.Voice data and RF IC 325, such as voice data and RF IC 50 or 70,includes a system on a chip (SoC) die 300, a memory die 302 a substrate306, bonding pads 308 and power management unit (PMU) 308, such ason-chip power management circuit 95′. This figure is not drawn to scale,rather it is meant to be a pictorial representation that illustrates thejuxtaposition of the SoC die 300, memory die 302, PMU 304 and thebonding pads 308. In particular, the voice data and RF IC 325 isintegrated in a package with a top and a bottom having a plurality ofbonding pads 308 to connect the voice data and RF IC 325 to a circuitboard, and wherein the on-chip power management unit 325 is integratedalong the bottom of the package. In an embodiment of the presentinvention, die 302 includes the memory module 230 and die 300 includesthe processing module 225. These dies are stacked and die bonding isemployed to connect these two circuits and minimize the number ofbonding pads, (balls) out to the package. Both SoC die 300 and memorydie 302 are coupled to respective ones of the bonding pads 308 viabonding wires or other connections.

PMU 304 is coupled to the SoC die 300, and/or the memory die 302 viaconductive vias, bonding wires, bonding pads or by other connections.The positioning of the PMU on the bottom of the package in a flip chipconfiguration allows good heat dissipation of the PMU 304 to a circuitboard when the voice data and RF integrated circuit is installed.

FIG. 12 is a bottom view of a pictorial representation of an embodimentof an integrated circuit package in accordance with the presentinvention. As shown, the bonding pads (balls) 308 are arrayed in an areaof the bottom of the integrated circuit with an open center portion 310and wherein the on-chip power management unit (PMU 304) is integrated inthe open center portion. While a particular pattern and number ofbonding pads 308 are shown, a greater or lesser number of bonding padscan likewise be employed with alternative configurations within thebroad scope of the present invention.

FIG. 13 is a flow chart of an embodiment of a method in accordance withthe present invention. In particular, a method is presented for use inconjunction with one or more of the functions and features described inconjunction with FIGS. 1-12. In step 400, a power mode signal isgenerated based on an operating mode of a voice data and RF integratedcircuit. In step 402, a transmit signal is generated using an RFtransmitter at one of a plurality of operating power ranges based on thepower mode signal. In step 404, at least one transmitter power supplysignal is generated that is selected in response to the power modesignal. In step 406, the RF transmitter is powered from at least onetransmitter power supply.

In an embodiment of the present invention, step 404 includes generatingan additional transmitter power supply signal in response to the powermode signal. Further, step 404 can include generating a firsttransmitter power supply signal having a first current limit in responseto a first value of the power mode signal, and generating a secondtransmitter power supply signal having a second current limit inresponse to a second value of the power mode signal. Also, step 404 caninclude generating a first transmitter power supply signal having afirst supply voltage in response to a first value of the power modesignal, and generating a second transmitter power supply signal having asecond supply voltage in response to a second value of the power modesignal.

FIG. 14 is a flow chart of an embodiment of a method in accordance withthe present invention. In particular, a method is presented thatincludes many of the steps of FIG. 13 that are referred to by commonreference numerals. In addition, the method includes step 405 ofgenerating a plurality of other power supply signals in response to thepower mode signal.

As may be used herein, the terms “substantially” and “approximately”provides an industry-accepted tolerance for its corresponding termand/or relativity between items. Such an industry-accepted toleranceranges from less than one percent to fifty percent and corresponds to,but is not limited to, component values, integrated circuit processvariations, temperature variations, rise and fall times, and/or thermalnoise. Such relativity between items ranges from a difference of a fewpercent to magnitude differences. As may also be used herein, theterm(s) “coupled to” and/or “coupling” and/or includes direct couplingbetween items and/or indirect coupling between items via an interveningitem (e.g., an item includes, but is not limited to, a component, anelement, a circuit, and/or a module) where, for indirect coupling, theintervening item does not modify the information of a signal but mayadjust its current level, voltage level, and/or power level. As mayfurther be used herein, inferred coupling (i.e., where one element iscoupled to another element by inference) includes direct and indirectcoupling between two items in the same manner as “coupled to”. As mayeven further be used herein, the term “operable to” indicates that anitem includes one or more of power connections, input(s), output(s),etc., to perform one or more its corresponding functions and may furtherinclude inferred coupling to one or more other items. As may stillfurther be used herein, the term “associated with”, includes directand/or indirect coupling of separate items and/or one item beingembedded within another item. As may be used herein, the term “comparesfavorably”, indicates that a comparison between two or more items,signals, etc., provides a desired relationship. For example, when thedesired relationship is that signal 1 has a greater magnitude thansignal 2, a favorable comparison may be achieved when the magnitude ofsignal 1 is greater than that of signal 2 or when the magnitude ofsignal 2 is less than that of signal 1.

The present invention has also been described above with the aid ofmethod steps illustrating the performance of specified functions andrelationships thereof. The boundaries and sequence of these functionalbuilding blocks and method steps have been arbitrarily defined hereinfor convenience of description. Alternate boundaries and sequences canbe defined so long as the specified functions and relationships areappropriately performed. Any such alternate boundaries or sequences arethus within the scope and spirit of the claimed invention.

The present invention has been described above with the aid offunctional building blocks illustrating the performance of certainsignificant functions. The boundaries of these functional buildingblocks have been arbitrarily defined for convenience of description.Alternate boundaries could be defined as long as the certain significantfunctions are appropriately performed. Similarly, flow diagram blocksmay also have been arbitrarily defined herein to illustrate certainsignificant functionality. To the extent used, the flow diagram blockboundaries and sequence could have been defined otherwise and stillperform the certain significant functionality. Such alternatedefinitions of both functional building blocks and flow diagram blocksand sequences are thus within the scope and spirit of the claimedinvention. One of average skill in the art will also recognize that thefunctional building blocks, and other illustrative blocks, modules andcomponents herein, can be implemented as illustrated or by discretecomponents, application specific integrated circuits, processorsexecuting appropriate software and the like or any combination thereof.

What is claimed is:
 1. A radio frequency (RF) integrated circuit (IC)comprising: a processing module that executes at least one applicationthat controls at least one non-transceiver module of a host device andthat determines a selected one of a plurality of power modes based onuse characteristics of the at least one application, and that generatesa power mode signal based on the selected one of the plurality of powermodes; and an RF transmitter, coupled to the processing module, thatgenerates a transmit signal, the RF transmitter that operates in aselected one of the plurality of operating modes based on the power modesignal and that operates from at least one transmitter power supplysignal generated and selected by a power management circuit in responseto the power mode signal; wherein the RF transmitter is coupled to amulti-input multi-output (MIMO) antenna to transmit the transmit signal.2. The RF IC of claim 1 wherein the power management circuit is coupledto the processing module, and wherein the power management circuitreceives the power mode signal and generates a plurality of power supplysignals including the at least one transmitter power supply signal. 3.The RF IC of claim 2 wherein the power management circuit includes anoff-chip circuit.
 4. The RF IC of claim 2 wherein the power managementcircuit includes an on-chip circuit that is implemented on the voicedata and RF IC.
 5. The RF IC of claim 1 wherein the power managementcircuit generates an additional transmitter power supply signal inresponse to the power mode signal.
 6. The RF IC of claim 1 wherein thepower management circuit generates a first transmitter power supplysignal having a first current limit in response to a first value of thepower mode signal, and a second transmitter power supply signal having asecond current limit in response to a second value of the power modesignal.
 7. The RF IC of claim 1 wherein the power management circuitgenerates a first transmitter power supply signal having a first supplyvoltage in response to a first value of the power mode signal, and asecond transmitter power supply signal having a second supply voltage inresponse to a second value of the power mode signal.
 8. The RF IC ofclaim 1 wherein the RF transmitter includes a plurality of poweramplifiers and a switching network coupled to the plurality of poweramplifiers, the switching network coupling the transmit signal from theplurality of power amplifiers in response to the power mode signal. 9.The RF IC of claim 8 wherein the plurality of power amplifiers areconfigured in series.
 10. The RF IC of claim 8 wherein the plurality ofpower amplifiers are configured in parallel.
 11. An integrated circuit(IC) comprising: a processing module that determines a selected one ofthe plurality of power modes based on a function being currentlyperformed by at least one non-transceiver module of a host device, andgenerates a power mode signal based on the selected one of the pluralityof power modes; and an RF transmitter, coupled to the processing module,that operates from at least one transmitter power supply signalgenerated and selected by a power management circuit in response to thepower mode signal; wherein the RF transmitter is coupled to amulti-input multi-output (MIMO) antenna to transmit the transmit signal.12. The IC of claim 11 wherein the power management circuit is coupledto the processing module, and wherein the power management circuitreceives the power mode signal and generates a plurality of power supplysignals including the at least one transmitter power supply signal. 13.The IC of claim 12 wherein the power management circuit includes anoff-chip circuit.
 14. The IC of claim 12 wherein the power managementcircuit includes an on-chip circuit that is implemented on the IC. 15.The IC of claim 11 wherein the power management circuit generates anadditional transmitter power supply signal in response to the power modesignal.
 16. The IC of claim 11 wherein the power management circuitgenerates a first transmitter power supply signal having a first currentlimit in response to a first value of the power mode signal, and asecond transmitter power supply signal having a second current limit inresponse to a second value of the power mode signal.
 17. The IC of claim11 wherein the power management circuit generates a first transmitterpower supply signal having a first supply voltage in response to a firstvalue of the power mode signal, and a second transmitter power supplysignal having a second supply voltage in response to a second value ofthe power mode signal.
 18. The IC of claim 11 wherein the RF transmittergenerates a transmit signal at a selected one of the plurality oftransmit power modes based on the power mode signal
 19. The IC of claim18 wherein the RF transmitter includes a plurality of power amplifiersand a switching network coupled to the plurality of power amplifiers,the switching network coupling the transmit signal from the plurality ofpower amplifiers in response to the power mode signal.
 20. An integratedcircuit (IC) comprising: a processing module that determines a selectedone of the plurality of power modes based on a function being currentlyperformed by at least one non-transceiver module of a host device, andgenerates a power mode signal based on the selected one of the pluralityof power modes; and an RF transmitter, coupled to the processing module,that operates from at least one transmitter power supply signalgenerated and selected by a power management circuit in response to thepower mode signal, wherein the power management circuit generates afirst transmitter power supply signal having a first supply voltage inresponse to a first value of the power mode signal, and a secondtransmitter power supply signal having a second supply voltage inresponse to a second value of the power mode signal; wherein the RFtransmitter is coupled to a multi-input multi-output (MIMO) antenna totransmit the transmit signal.